Released on 2 July, Honor X10 Max will use Mediatek Dimensity 800 SoC
Honor, a sub-brand of Huawei, has finally released its newest smartphone, the Honor X10 Max. This news has been confirmed through a post from the president of the company through his weibo account, he said that his new smartphone will be released on July 2, 2020.
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President of Honor Zhao Ming, in a post on his weibo account, said that the X series will carry a wide screen.
Zhao said because it has been 2 years they have not made a smartphone with a wide screen. The company also promises a comprehensive upgrade in the X series.
He also said that the Honor X10 Max is not new to him, because the company itself is preparing a phablet with a wide screen and a Pro version for the X10 series in the future.
Leaked Specifications of Honor X10 Max
Instead of using Kirin, Honor prefers to use Mediatek’s SoC, namely Dimensity 800. Honor reasons because they don’t want the launch timeline to be disrupted due to their dispute with the US.
Mediatek Dimensity 800 is a Mid-range SoC that can deliver competitive performance in its class. This SoC is built on a 7nm process with support for NSA/SA 5G with dual-carrier aggregation.
With this support, it can make 5G networks increase by 30% for seamless connectivity and more efficient battery usage. Honor X10 Max is said to have a main camera with a resolution of 48MP and 8MP for the front camera.
For the battery, this smartphone is equipped with a 5000mAh battery and supports fast charging up to 22.5W. Honor X10 Max will be present using the Magic UI 3.1 interface based on Android 10.
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